Recently a new leak regarding the specification as well as the images has been noticed regarding the LeEco Le 2. Though all of these information was leaked on the Weibo, MyDrivers actually holds all of these images.
According to the images, it can be said that this smartphone may come with a complete new bezel-less design along with the appearance of the new LeEco logo instead of the Letv logo in the rear panel. The phone may come in a metal body architecture & the camera module may be of square shape instead of being a circular one. It is expected that the volume as well as the lock/power buttons may present at the right sides though there is a presence of the ultrasonic fingerprint sensor too.
At the bottom of the device, there may be the presence of the USB Type-C port as well as the speaker grills. According to the leaked specification, this can be said that this smartphone may be powered by the Snapdragon 820 SoC or the MediaTek Helio X20 SoC processor along with the presence of the 4GB RAM as well as 21MP rear camera too.